A review and prediction of chip scale solder joint reliabilityGHAFFARIAN, R.SPIE proceedings series. 1997, pp 109-110, isbn 0-930815-50-5Conference Paper

New wafer level structure for stress free area array solder attachFILLION, R; MEYER, L; DUROCHER, K et al.SPIE proceedings series. 2003, pp 687-692, isbn 0-8194-5189-4, 6 p.Conference Paper

Reliability of a wafer level packaging method with plastic-core solder bumps: Utilizing Sn-Ag solder at 0.3 mm diameterSUMIKAWA, Masato; MURAYAMA, Rina; OGAWA, Masashi et al.SPIE proceedings series. 2003, pp 693-698, isbn 0-8194-5189-4, 6 p.Conference Paper

Splice testing for LHC quadrupole magnetsBARZI, E; BOSSERT, R; FEHER, S et al.IEEE transactions on applied superconductivity. 2003, Vol 13, Num 2, pp 1301-1304, issn 1051-8223, 4 p., 2Conference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Reflow of AuSn Solder Creates Strong JointsGOLOSKER, Ilya; FLORANDO, Jeffrey.Welding journal. 2013, Vol 92, Num 2, pp 48-59, issn 0043-2296, 12 p.Article

2009 Pb-Free SoldersKANG, Sung K; ANDERSON, Iver; HANDWERKER, Carol et al.Journal of electronic materials. 2009, Vol 38, Num 12, issn 0361-5235, 362 p.Conference Proceedings

No-fault-found and intermittent failures in electronic productsHAIYU QI; GANESAN, Sanka; PECHT, Michael et al.Microelectronics and reliability. 2008, Vol 48, Num 5, pp 663-674, issn 0026-2714, 12 p.Article

Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substratesKWANG LUNG LIN; PEI CHI LIU; JENN MING SONG et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1310-1313Conference Paper

Estimation of Sn-3.0Ag-0.5Cu solder joint reliability by Weibull distribution and modified Coffin-Manson equationYAMABE, Mitsuharu.SPIE proceedings series. 2003, pp 823-828, isbn 0-8194-5189-4, 6 p.Conference Paper

A micromachined Ball Grid Array test socket for fine-pitch interconnectHUANG, B; ANG, S. S; PORTER, E. V et al.SPIE proceedings series. 2000, pp 172-177, isbn 0-930815-62-9Conference Paper

A novel measurement technique for stencil printed solder pasteDUSEK, Milos; HUNT, Christopher.Soldering & surface mount technology. 2003, Vol 15, Num 2, issn 0954-0911, 5, 35-45 [12 p.]Article

Lead free soldering technology for mobile equipmentTANAKA, Yasunori; TAKAHASHI, Junichi; KAWASHIMA, Kazuyuki et al.SPIE proceedings series. 2000, pp 314-319, isbn 0-930815-62-9Conference Paper

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

Reliability evaluation for solder joints in embed electronic packageYAMABE, Masashi; QIANG YU; SHIBUTANI, Tadahiro et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, Vol 6798, pp 67980S.1-67980S.10, issn 0277-786X, isbn 978-0-8194-6969-4 0-8194-6969-6, 1VolConference Paper

Verbesserte Momentenübertragung in Welle-Nabe-Verbindungen durch Press-Presslöt-Verbindungen = Improved moment transfer in shaft hub joints through press soldered fittingsFÜSSEL, Uwe; KÜPPERS, Martin; LIPOTH, Istvan et al.VDI-Berichte. 2003, pp 247-258, issn 0083-5560, isbn 3-18-091790-3, 12 p.Conference Paper

Design guidelines to implement Six Sigma in assembly process yield of area array solder interconnect packagesCHUNHO KIM; BALDWIN, Daniel F.Proceedings - Electronic Components Conference. 2002, pp 1560-1568, issn 0569-5503, isbn 0-7803-7430-4, 9 p.Conference Paper

Special Issue on Packaging and Soldering Technologies for Electronic InterconnectsGHOSH, Gautam; WEISER, Martin; MAVOORI, Hareesh et al.Journal of electronic materials. 2000, Vol 29, Num 10, issn 0361-5235, 188 p.Conference Proceedings

Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni―W substratesJIAXING LIANG; TINGBI LUO; ANMIN HU et al.Microelectronics and reliability. 2014, Vol 54, Num 1, pp 245-251, issn 0026-2714, 7 p.Article

Effect of Cr additions on interfacial reaction between the Sn―Zn―Bi solder and Cu/electroplated Ni substratesJINGLIN BI; ANMIN HU; JING HU et al.Microelectronics and reliability. 2011, Vol 51, Num 3, pp 636-641, issn 0026-2714, 6 p.Article

Effect of isothermal aging on the intermetallic compound layer growth in BGA joints with Sn-Ag-Cu solderYOON, Jeong-Won; LEE, Chang-Bae; QUESNEL, David J et al.SPIE proceedings series. 2003, pp 465-470, isbn 0-8194-5189-4, 6 p.Conference Paper

Mechanical reinforcement for sphere attach applicationsBROWN, Maureen; JUNG, Richard; JIN LIU et al.SPIE proceedings series. 2003, pp 937-942, isbn 0-8194-5189-4, 6 p.Conference Paper

Failure modes of flip chip solder joints under high electric current stressingHUA YE; BASARAN, Cemal; HOPKINS, Douglas C et al.SPIE proceedings series. 2003, pp 801-806, isbn 0-8194-5189-4, 6 p.Conference Paper

A theory of fatigue: A physical approach with application to lead-rich solderWEN, S; KEER, L. M.Journal of applied mechanics. 2002, Vol 69, Num 1, pp 1-10, issn 0021-8936Article

An efficient ball grid array routerXIAOYU SONG; SHAODI GAO; CHAKRAVARTHYT, Tejasvi P et al.International journal of electronics. 2002, Vol 89, Num 4, pp 317-324, issn 0020-7217Article